June 3 2012: SBS Science & Technology Co., Ltd. (SBS) launched small size, high reliability and rugged series processor modules powered by 3rd generation Intel® Core™ processor family. Modules launched today include SCM8100 which is in standard PCIe/104 form factor and COMe8030 compliant with COM express specifications. Featuring high CPU performance, rich 3D graphics performance, faster transcode speed, reduced manageability cost and improved security, the modules are with rugged design to fulfill given tasks even in rigorous natural conditions, therefore eligible to meet application demands of intelligent device, digital signage, security surveillance, electric power, industrial automation, medical imaging and transmitting device etc. These modules will be officially marketed worldwide starting in Q3 of 2012.
Zhao Yong, president of SBS Science & Technology Co., Ltd. said, “SBS is engaged in design and manufacturing of highly reliable embedded computers. Ever since 1992, SBS has been focused on the main product line of high reliable, low power and ultra small size embedded computers and has maintained its leading edge in the Chinese market. Modules in this launch are industrial design features with high reliability, high platform integration, high power efficiency, rich graphics, improved security and manageability. These modules are particularly suitable for applications such as intelligent device, digital signage, security surveillance, electric power, industrial automation, medical imaging and transmitting device, etc. Series processor modules launched today are among the first products that are based on 3rd generation Intel® Core™ processor family. This demonstrates SBS’ leadership in China’s embedded community and reveals that SBS has joined the ranks of world leaders in embedded system design and manufacturing.”
“The 3rd generation Intel® Core™ processor family enables intelligent systems to handle more robust data loads and deliver best in-class stunning visuals to end users,” said Matt Langman, director of marketing, Intel Intelligent Systems Division. “Newly enhanced, built-in technologies enable data security, system responsiveness and manageability. Plus, it is cross compatible with the 2nd generation Intel® Core™ processor family to enable versatile upgrades without additional design cost.”
Compared to the 2nd Gen Intel® Core™ Processor Family, the 3rd generation Intel® Core™ processor family delivers up to 15% more CPU performance and up to 50% more 3D Graphics performance and up to 1.8x transcode speed. The platform also includes all new USB 3.0 and PCIe 3.0 support.
SBS series processor modules launched today utilizes 3rd generation Intel® Core™ processor family and supports full HD 1080P, up to 8GB DDR3 memory, SATA SSD, WiFi, Bluetooth, PCIe extension, etc. Utilizing the lowest power of 17W of the 3rd generation Intel® Core™ Processor family, the modules are with fanless design and the ultra low power consumption also enables longer battery life. The modules are with rugged design and with extended operating temperature from -40℃ to +85℃. All these enable the modules to meet different application requirements and make them an ideal choice of portable intelligent device for industrial applications. These modules are offered with 7 years embedded lifecycle support.